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Juan Carlos López
Senior WriterAn engineer by training. A science and tech journalist by passion, vocation, and conviction. I've been writing professionally for over two decades, and I suspect I still have a long way to go. At Xataka, I write about many topics, but I mainly enjoy covering nuclear fusion, quantum physics, quantum computers, microprocessors, and TVs.
Karen Alfaro
WriterCommunications professional with a decade of experience as a copywriter, proofreader, and editor. As a travel and science journalist, I've collaborated with several print and digital outlets around the world. I'm passionate about culture, music, food, history, and innovative technologies.
Over the past year and a half, Huawei and SMIC have drawn significant attention in the semiconductor industry. These two Chinese companies have collaborated to develop technology that enables the production of 7 nm integrated circuits using ASML’s deep ultraviolet (DUV) lithography equipment. However, U.S. sanctions prevent ASML from selling its most advanced extreme ultraviolet (EUV) lithography machines to Chinese customers, restricting their access to cutting-edge chipmaking technology.
While EUV lithography is essential for large-scale production of 7 nm and more advanced chips, Huawei and SMIC have managed to achieve this using DUV technology through a technique called multiple patterning. This method involves transferring a pattern to the wafer in multiple passes, enhancing resolution but increasing costs and reducing production efficiency.
SiCarrier: The Company Behind the Breakthrough
In recent days, several Asian media outlets, including the South China Morning Post and Nikkei Asia, have spotlighted SiCarrier, a Chinese lithography equipment manufacturer that is poised to take center stage at Semicon China, a major semiconductor industry trade show in Shanghai. Despite its low profile, SiCarrier is attracting attention for several reasons.
The technology Huawei and SMIC used to produce 7 nm chips reportedly stems from a SiCarrier patent.
First, the company has a close but not entirely transparent relationship with Huawei. Additionally, it receives financial backing from the Shenzhen government. Most notably, the technology Huawei and SMIC used to produce 7 nm chips reportedly stems from a SiCarrier patent designed to enable 5 nm chip production using DUV lithography equipment.
Despite being founded in 2021, SiCarrier has deliberately kept a low profile for four years—a strategic decision likely influenced by the Chinese government. According to Nikkei Asia, SiCarrier aims to compete with leading semiconductor equipment makers, including ASML, Tokyo Electron, and Applied Materials. As the company prepares to unveil its latest equipment at Semicon China, the industry will be watching closely to see if it meets expectations.
Image | SiCarrier
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